Halbleiterbauelement mit Druckkontakt

摘要

Provided a pressure-contact type semiconductor device including: a plurality of semiconductor chips; a heat buffer plate provided on one surface side of the plural semiconductor chips; and a metal electrode plate provided on the heat buffer plate on a side opposite the plural semiconductor chips, a surface thereof at any position not facing the plural semiconductor chips on the heat buffer plate side having a region which alleviates elastic deformation of the heat buffer plate. Also provided is a pressure-contact type semiconductor device including: a plurality of semiconductor chips; a heat buffer plate provided on one surface side of the plural semiconductor chips; and a metal electrode plate provided on the heat buffer plate on a side opposite the plural semiconductor chips, a peripheral shape thereof extending beyond and thus being larger than a peripheral shape of the heat buffer plate.