| 摘要 |
<p>A B-stageable adhesive is provided to be used in electronic applications, exhibit excellent adhesion to electronic parts such as a lead and a substrate including LCP, and achieve a perfect sealing between a substrate and a lead. A B-stageable adhesive for electronic parts comprises at least one solid epoxy, at least one latent hardener, at least one thixotropic agent, and at least one solvent. At least one of the solid epoxy is a flexibilized epoxy. The at least one latent hardener includes at least one imidazole. The at least one thixotropic agent is selected from the group consisting of inorganic filler, metallic filler, organic thixotropic agents, and a mixture thereof. The at least one solvent is selected from the group consisting of ketones, esters, alcohols, ethers, gamma-butyrolactones, acetates, propyleneglycol methylethylacetate, and a mixture thereof.</p> |
