| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and method capable of stably inspecting, at a high speed and high sensitivity, a micro foreign substance or pattern defect occurring during a device manufacturing process of forming a circuit pattern on a substrate of a semiconductor device or the like. SOLUTION: Dark field illumination is applied to an inspected object having a transparent film on its surface from a plurality of illumination directions and illumination angles using broad band illumination of different wavelengths and a single wavelength, and reflected/scattered light from a repeating pattern section and non-repeating pattern is detected by wavelength division. Thus, reflected/scattered light from a foreign substance or defect on the surfaces of the repeating pattern and non-repeating pattern and the surface of the transparent film is effectively detected. A micro defect is stably detected by providing the inspection device with a function of removing diffraction light of the repeating pattern from a diffraction image of a real pattern and design data of the pattern. COPYRIGHT: (C)2007,JPO&INPIT
|
