| 摘要 |
Methods and apparatus are provided for encapsulating electronic devices, comprising: providing one or more electronic devices ( 62 ) with primary faces ( 63 ) having electrical contacts ( 69 ), opposed rear faces ( 65 ) and edges ( 64 ) therebetween. A sacrificial layer ( 70 ) is provided on the primary faces ( 63 ). The devices ( 62 ) are mounted on a temporary support ( 80 ) so that the sacrificial layer ( 70 ) faces toward the temporary support ( 80 ). A plastic encapsulation ( 86 )is formed in contact with at least the lateral edges ( 64 ) of the electronic devices ( 62 ). The plastic encapsulation ( 86 ) is at least partially cured and the devices ( 62 ) and plastic encapsulation ( 86 ) separated from the temporary support ( 80 ), thereby exposing the sacrificial layer ( 70 ). The sacrificial layer ( 70 ) is removed. The devices ( 62 ) and edge-contacting encapsulation are mounted on a carrier ( 90 ) with the primary faces ( 63 ) and electrical contacts ( 69 ) exposed and, optionally, further cured. Insulators ( 94 ) and conductors ( 96 ) applied to the primary faces couple electrical contacts ( 69 ) on various devices ( 62 ) to each other and to external contacts, thereby forming an integrated multi-device panel ( 88'' ).
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