The present invention relates to methods of preparing a substrate for bonding that includes applying a cleanser to a reaction injection molded component. The substrate is dried to remove some or all of the liquid of the cleanser. The invention also relates to methods of bonding two substrates together. After cleaning the surface of one substrate with a basic solution, a primer may be applied to the cleaned surface or to a second substrate. An adhesive is then used to join the substrates together.
申请公布号
WO2007079366(A3)
申请公布日期
2007.09.13
申请号
WO2006US62498
申请日期
2006.12.21
申请人
DOW GLOBAL TECHNOLOGIES, INC.;MAHDI, SYED, Z.;ALLAM, DOMINIC, JOSEPH;SEVIDAL-MARTE, SUSAN, A.
发明人
MAHDI, SYED, Z.;ALLAM, DOMINIC, JOSEPH;SEVIDAL-MARTE, SUSAN, A.