摘要 |
<p>The method involves connecting a hard soldering section (20a) with components (10, 11) e.g. electronic component, to be assembled by cold or hot welding in a firmly bonded and a form-fitting manner. An area of one of the components to be assembled is brought in contact with the hard soldering section of the other component to be assembled. The hard soldering section is heated and partly melted.</p> |