APPARATUS AND METHOD FOR CUTTING SHEET

摘要

A sheet cutting apparatus (10) is provided for cutting a sheet (S), which has a size covering over the outer circumference of a semiconductor wafer (W), along the outer circumference of the semiconductor wafer. The apparatus is provided with a robot (12) for holding a cutter blade (13) at an insertion depth so that the blade is brought into contact with the upper plane of the semiconductor wafer (W). The blade edge of the cutter blade (13) is inserted into the sheet (S) at an inner position very close to the outer circumference of the semiconductor wafer (W), and by rotating the cutter blade (13) within a flat plane in such state, the sheet is cut smaller than the size of the semiconductor wafer (W).