| 摘要 |
PROBLEM TO BE SOLVED: To provide a power amplifier excellent in productivity, and prominent in characteristics as a heat dissipation route and an electric grounding route. SOLUTION: The power amplifier has an FET mounted on a circuit board into a metallic case 5. The FET is contacted with the metallic case 5 by a contact surface 13 through a cover 2, a metallic plate 14 soldered to the cover 2, and silicon grease applied on the metallic plate 14. A grounding wiring is electrically connected on the circuit board through the metallic plate 14. COPYRIGHT: (C)2007,JPO&INPIT
|
