| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device securing insulation even if the distance between external connection terminals and that between external electrodes is short by reducing the resistance of the bonding section between the positive side external connection terminal and negative side external connection terminal of the semiconductor device while the occurrence of inductance is being suppressed and the external electrode bonded to each external connection terminal. SOLUTION: The semiconductor device 10 comprises: the planar positive side external connection terminal 11 and the planar negative side one 12. The positive side external electrode 14 and the negative side one 15 are electrically connected to both the external connection terminals 11, 12 while being bonded by each entire opposing surface. Both the positive side and negative side external connection terminals 11, 12 and the positive side and negative side external electrodes 14, 15 are electrically connected while the faces are in parallel and an electrical insulation section (insulator plate 16, insulating resin section 17) is arranged continuously between both the external connection terminals 11, 12 and both the external electrodes 14, 15. COPYRIGHT: (C)2007,JPO&INPIT
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