| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component incorporating module which module prevents a decrease in the wet area of a solder connection due to a lift phenomenon of a chip component after secondary mounting reflow of electronic equipment, and also prevents the occurrence of a boundary separation, thereby offering improved reliability. <P>SOLUTION: The electronic component incorporating module 10 includes a resin wiring board 11, a plurality of electronic components 15, 15 mounted on the surface of the resin wiring board 11, solder 22 connecting each electronic component 15 electrically to the resin wiring board 11, and a sealing resin 21 sealing each electronic component 15 and the solder 22. The average linear expansion coefficient α of the sealing resin 21 calculated by the equation: α=äα1×(Tg-Tr)+α2×(Tp-Tg)}/(Tp-Tr), ranges from 17×10<SP>-6</SP>to 110×10<SP>-6</SP>/°C. The average linear expansion coefficient α is calculated using the glass transition temperature Tg of the resin 21, a linear expansion coefficient α1 given at a temperature equal to or lower than the glass transition temperature Tg, a linear expansion coefficient α2 given at a temperature equal to or higher than the glass transition temperature Tg, an indoor temperature Tr, and a peak temperature Tp at a time of reflow. <P>COPYRIGHT: (C)2007,JPO&INPIT |
