| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a component incorporated printed wiring board superior in reliability and an electronic device. <P>SOLUTION: A gap (g) is impregnated with a filler 15 between a circuit 13 and the pattern formation surface of a first substrate 11 wherein the circuit 13 is provided, and the gap (g) is entirely filled with a filler 15a. Then the filler 15 is used to form an insulation layer having such thickness as to cover the circuit part 13, on the pattern formation surface of the first substrate 11. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
