| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent a bonding pad and an internal wire insulated from the bonding pad from being short-circuited due to a probing on a probing pad. <P>SOLUTION: A semiconductor wafer comprises a plurality of chip regions 3 which are separated mutually by a scribe line 5 and are disposed in a matrix manner, and bonding pads 9 and probing pads 11 are disposed in the chip regions 3. The bonding pads 9 and the probing pads 11 are disposed mutually at intervals. The bonding pads 9 are electrically connected to the probing pads 11 through metal wiring layers 17-2b, 17-3b, 17-4b, 17-5b disposed in the scribe line 5. The metal wiring layers 17-2b, 17-3b, 17-4b, 17-5b disposed in the scribe line 5 are removed upon cutting the scribe line 5. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
