发明名称 SLURRY FOR POLISHING
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a slurry for polishing showing a high polishing speed for extremely suppressing the generation of scratch, dishing, erosion or fang. <P>SOLUTION: This slurry for metallic polishing contains vinyl monomer 1 to 99 pts.wt. having a functional group where negative ion can be formed; a copolymerization resin obtained by polymerizing the other vinyl system monomer 1 to 99 pts.wt.; and a water-soluble compound from which complex with metal can be formed and oxidant. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007235001(A) 申请公布日期 2007.09.13
申请号 JP20060057115 申请日期 2006.03.03
申请人 MITSUI CHEMICALS INC 发明人 OIKE SETSUKO;ETO AKINORI;FUJII SHIGEHARU;SHINDO KIYOTAKA
分类号 H01L21/304;B24B37/00;C09K3/14 主分类号 H01L21/304
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