| 摘要 |
PROBLEM TO BE SOLVED: To obtain a curing promoter that is useful for an epoxy resin and has an excellent pot life, an epoxy resin composition having excellent curability, fluidity and handleability and to provide a semiconductor apparatus having excellent solder crack resistance and moisture resistance reliability. SOLUTION: The curing promoter for an epoxy resin has a structure represented by formula (1) (X is a reaction residue of an organic group to be reacted with a phenolic hydroxy group). COPYRIGHT: (C)2007,JPO&INPIT |
