| 摘要 |
PROBLEM TO BE SOLVED: To provide a configuration measuring apparatus which can be set on a set stage without damaging any thin plate nor allowing any warpage to occur, and can be instantly fixed to and unfixed from the set stage. SOLUTION: The configuration measuring apparatus 1, which measures a configuration of a thin film formed on an electrostatically chargeable thin plate W or a configuration of a surface of the electrostatically chargeable thin plate by using a noncontact way, comprises: the set stage 4 for setting the thin plate W; and a measuring device 6 which is out of contact with the thin plate W being set on the set stage 4 and measures the configuration of the thin film or the configuration of the surface of the thin plate. Furthermore, an electrostatic sucking mechanism 5 for sucking the thin plate W electrostatically is incorporated in the set stage 4. COPYRIGHT: (C)2007,JPO&INPIT
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