发明名称 |
INTEGRATED CIRCUIT PACKAGE RESISTANCE MEASUREMENT |
摘要 |
An integrated circuit comprises a node (112) to couple one or more components (130) to the integrated circuit (110) to carry current through a package (120) for the integrated circuit. The integrated circuit also comprises a monitor (140) to measure a resistance of the package based at least in part on a reference resistance of the package and a resistance of one or more components that are to carry current through the package. For another disclosed embodiment, current through one or more components that are to carry current through a package for an integrated circuit is controlled. A resistance of the package is measured based at least in part on a reference resistance of the package and a resistance of one or more components that are to carry current through the package . |
申请公布号 |
WO2007047178(A3) |
申请公布日期 |
2007.09.13 |
申请号 |
WO2006US39247 |
申请日期 |
2006.10.06 |
申请人 |
INTEL CORPORATION;KUMAR, ARVIND;MUNSHI, KAMBIZ |
发明人 |
KUMAR, ARVIND;MUNSHI, KAMBIZ |
分类号 |
G01R27/00;G01R31/30;G06F1/26 |
主分类号 |
G01R27/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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