发明名称 INTEGRATED CIRCUIT PACKAGE RESISTANCE MEASUREMENT
摘要 An integrated circuit comprises a node (112) to couple one or more components (130) to the integrated circuit (110) to carry current through a package (120) for the integrated circuit. The integrated circuit also comprises a monitor (140) to measure a resistance of the package based at least in part on a reference resistance of the package and a resistance of one or more components that are to carry current through the package. For another disclosed embodiment, current through one or more components that are to carry current through a package for an integrated circuit is controlled. A resistance of the package is measured based at least in part on a reference resistance of the package and a resistance of one or more components that are to carry current through the package .
申请公布号 WO2007047178(A3) 申请公布日期 2007.09.13
申请号 WO2006US39247 申请日期 2006.10.06
申请人 INTEL CORPORATION;KUMAR, ARVIND;MUNSHI, KAMBIZ 发明人 KUMAR, ARVIND;MUNSHI, KAMBIZ
分类号 G01R27/00;G01R31/30;G06F1/26 主分类号 G01R27/00
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