| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin injection molded product such as a case or the like not causing tensile, compression or bending stress in the connection part of a wiring board to destruct the connection of the wiring board even if the resin injection molded product such as the case or the like is expanded and contracted by a temperature change. SOLUTION: The resin injection molded product, in which at least a part of a terminal T<SB>1</SB>comprising a metal conductor is embedded, is formed of a resin material of which the coefficient of linear expansion is larger than that of the material of the terminal T<SB>1</SB>and equipped with a substrate part 1, a wiring board support part integrally protruded from the substrate part 1 to support the wiring board so as to allow the same to be spaced apart by a predetermined distance and an terminal supporting protruded part 7 integrally protruded from the substrate part 1 so as to become a height almost the same as that of the wiring board support part toward the wiring board. COPYRIGHT: (C)2005,JPO&NCIPI |
