发明名称 Intergrated circuit package with coplanar transmission lines
摘要 Housing (100) for an integrated circuit (10) has an arrangement of contact conductors (18, 20) which are electrically connected to the contacts (16, 17) provided in the housing. The contact conductors contact the contact surfaces (14) with a free contact end. At least a few of the conductors are formed as coplanar conductor structures having a predetermined impedance. Preferred Features: The integrated circuit is a semiconductor chip.
申请公布号 EP1174922(B1) 申请公布日期 2007.09.12
申请号 EP20010116397 申请日期 2001.07.06
申请人 ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KG 发明人 ROSENBERGER, BERND
分类号 H01L23/66;H01L23/047;H01L23/48 主分类号 H01L23/66
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