发明名称 |
Intergrated circuit package with coplanar transmission lines |
摘要 |
Housing (100) for an integrated circuit (10) has an arrangement of contact conductors (18, 20) which are electrically connected to the contacts (16, 17) provided in the housing. The contact conductors contact the contact surfaces (14) with a free contact end. At least a few of the conductors are formed as coplanar conductor structures having a predetermined impedance. Preferred Features: The integrated circuit is a semiconductor chip. |
申请公布号 |
EP1174922(B1) |
申请公布日期 |
2007.09.12 |
申请号 |
EP20010116397 |
申请日期 |
2001.07.06 |
申请人 |
ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KG |
发明人 |
ROSENBERGER, BERND |
分类号 |
H01L23/66;H01L23/047;H01L23/48 |
主分类号 |
H01L23/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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