发明名称 OPTIMIZATION OF PARAMETERS FOR SEALING ORGANIC EMITTING LIGHT DIODE (OLED) DISPLAYS
摘要 A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein. In one embodiment, the hermetically sealed glass package is suitable to protect thin film devices which are sensitive to the ambient environment. Some examples of such glass packages are organic emitting light diode (OLED) displays, sensors, and other optical devices. The present invention is demonstrated using an OLED display as an example.
申请公布号 EP1831938(A1) 申请公布日期 2007.09.12
申请号 EP20050810112 申请日期 2005.10.19
申请人 CORNING INCORPORATED 发明人 REDDY, KAMJULA, P.;SCHROEDER, JOSEPH, F.;BECKEN, KEITH, J.;LOGUNOV, STEPHAN, L.;STRZEPEK, HOLLY, J.
分类号 H01L51/52 主分类号 H01L51/52
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