发明名称 SUBSTRATE PROCESSING APPARATUS, METHOD FOR EXAMINING SUBSTRATE PROCESSING CONDITIONS, AND STORAGE MEDIUM
摘要 <p>A substrate processing apparatus is provided to enable correction of a process condition by removing prohibition of variation of a process condition while a predetermined number of substrates are being processed. A substrate is processed in a substrate processing unit. While a predetermined number of substrates are processed, a prohibition part prohibits variation of the process condition of the process. A removal part removes the prohibition of the variation of the process condition, the predetermined number of substrates being processed. A correction part corrects the process condition. A transfer prohibition part can prohibit the substrate from being transferred to the substrate processing unit. The correction part can correct the process condition when the substrate is prohibited from being transferred to the substrate processing unit.</p>
申请公布号 KR20070092137(A) 申请公布日期 2007.09.12
申请号 KR20070022262 申请日期 2007.03.07
申请人 TOKYO ELECTRON LIMITED 发明人 YOKOUCHI TAKESHI;YAGI FUMIKO
分类号 H01L21/00;H01L21/205;H01L21/304;H01L21/3065 主分类号 H01L21/00
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