SUBSTRATE PROCESSING APPARATUS, METHOD FOR CHUCKING A SUBSTRATE, AND STORAGE MEDIUM

摘要

A substrate processing apparatus is provided to prevent generation particles by applying a negative voltage to an electrode plate by a DC power source when a substrate is absorbed by an electrostatic chuck, so that electricity is discharged as a glow type from the parts in a process chamber installed at the edge of the substrate or in the periphery of the substrate and deposits are not separated and scattered from the inner wall of the process chamber. A substrate(W) processing apparatus(10) for processing a substrate includes a process chamber(11) and a mounting table. The substrate is received in a chamber. The substrate is mounted on the mounting table disposed in the process chamber. An electrostatic chuck(42) made of an insulation member having an electrode plate(23) in its inside is positioned on the mounting table. A DC power source is connected to the electrode plate. When the substrate is absorbed by the electrostatic chuck, a negative voltage is applied to the electrode plate by the DC power source. An RF power source is connected to the mounting table. The RF power source applies RF power to the mounting table before the DC power source applies the negative voltage to the electrode plate.