PRINTED CIRCUIT BOARD FOR BALL GRID ARRAY

摘要

A printed circuit board for a ball grid array is provided to enhance a coupling property between a solder ball and a pad by increasing a size of a pad while maintaining a distance between the pads above a predetermined value. A printed circuit board(100) for a ball grid array includes at least two pads. A solder ball(400) is attached to the pad. The pads are elongated, so that a distance between the pads is maintained to be equal to or greater than a predetermined value and a coupling area between the solder ball and the pads(200) is increased. Outer sides of the pads to face each other are arranged to be parallel to each other. An outer side of the pad corresponding to a side portion of a lead line(300) is arranged to be parallel to the side portion of the lead line.