SUBSTRATE POLISHING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A substrate polishing method is provided to polish easily the same quantity as other substrates polished by using all carriers without adding a dummy substrate even if the substrate is polished by a part of the carriers by including a plurality of carriers with respect to one polishing pad and by pressing a substrate supported by corresponding carriers to the polishing pad. In polishing a substrate by using all carriers, an interval of polishing time necessary for polishing a predetermined quantity is obtained(S61). A correction coefficient is obtained which indicates a correlation between an interval of polishing time for polishing the substrate by using all carriers and an interval of polishing time for polishing the substrate by using only a part of the carriers. Based upon the obtained interval of polishing time, an interval of polishing time necessary for polishing a predetermined quantity is calculated in polishing the substrate by using only a part of the carriers(S62). Based upon a calculated interval of corresponding polishing time, the substrate is polished by using only a part of the carriers(S63). The correction coefficient can be a value corresponding to the number of carriers used in polishing the substrate.