APPARATUS AND METHOD FOR TREATING SUBSTRATES

摘要

A substrate treating apparatus and a substrate treating method using the same are provided to reduce the consumption of a plasma processing gas and the amount of power applied to a plasma discharge electrode by minimizing the area of the plasma discharge electrode and to improve the uniformity of a substrate treating process by adjusting a tilt angle of the plasma discharge electrode. A substrate treating apparatus includes a substrate support member(100) for loading and rotating a substrate and a plasma generating unit. The plasma generating unit is formed like a bar type structure extended from a center portion of the substrate to a peripheral portion. The plasma generating unit is used for supplying plasma to the substrate. The substrate treating apparatus further includes a first driving unit and a second driving unit. The first driving unit(220) is used for adjusting the gradient of the plasma generating unit against the substrate. The second driving unit(230) is used for moving the plasma generating unit up and down.