发明名称 Method for manufacturing solid-state imaging devices
摘要 A housing including a base and rectangular frame-shaped ribs is resin molded in one piece with a plurality of metal lead pieces, forming internal terminal portions and external terminal portions with the metal lead pieces, an imaging element is fixed onto the base inside an internal space of the housing, electrodes of the imaging element are connected respectively to the inner terminal portions of the metal lead pieces, and a transparent plate is joined to an upper face of the ribs. In order to position the transparent plate, a stepped portion is formed on the top face of the ribs by providing a lower step that is lowered along an internal periphery. The transparent plate has a size capable of being mounted onto an upper surface of the lower step within a region inward of an inner wall formed by the stepped portion of the ribs. When fixing the transparent plate to the upper face of the ribs, an adhesive is provided on the upper face of the lower step, the transparent plate is placed on the adhesive to be fixed to the upper surface of the lower step while regulating its position with the inner wall of the stepped portion, and then the portion positioned outside the stepped portion of the ribs is removed. It is easy to position the transparent plate on the upper face of the rib.
申请公布号 US7268016(B2) 申请公布日期 2007.09.11
申请号 US20040901850 申请日期 2004.07.28
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 MINAMIO MASANORI;SANO HIKARI
分类号 H01L21/44;H01L27/14;H01L23/00;H01L23/02;H01L23/08;H01L23/10;H01L23/50;H01L27/146;H01L31/0203;H04N5/335;H04N5/369;H04N5/372 主分类号 H01L21/44
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