发明名称 APPARATUS FOR RINSING WAFER SIDE AND SPINNER USED THE SAME
摘要 <p>An apparatus for rinsing a wafer side and a spinner including the same are provided to prevent process errors due to inflow of a rinse solution to a center of a wafer in a side rinse process by using a side rinse arm surrounding an edge circumference of the wafer. A spin chuck(222) is used for rotating a wafer(W) on which photoresist is coated. An injection nozzle(224) is used for injecting a rinse solution from an edge of the spin chuck to the photoresist coated on an outer circumference of the wafer. The injection nozzle is directed from a center to an outer circumference on the wafer. A side rinse arm(226) is formed to surround a rim of an edge of the wafer so that the rinse solution is not transferred from the outer circumference to the center of the wafer. The side rinse arm has a C-shaped structure for covering the injection nozzle installed therein.</p>
申请公布号 KR20070091423(A) 申请公布日期 2007.09.11
申请号 KR20060020877 申请日期 2006.03.06
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, KWANG IL
分类号 H01L21/027 主分类号 H01L21/027
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