APPARATUS FOR CLEANING WAFER

摘要

A wafer cleaning apparatus is provided to minimize a temperature difference of a cleaning solution by using plural heaters, thereby removing a difference of etching rate and obtaining a uniform cleaning effect. A first plate(110) holds a wafer(W), and has a first supply tube for supplying a cleaning solution onto a first surface of the wafer. A second plate(120) has a second supply tube for supplying the cleaning solution onto a second surface of the wafer and a ultrasonic vibrator(124). Plural heaters(128) heat the cleaning solutions provided on the first and the second surfaces of the wafer. The heater is positioned on any one of the first and the second plates.