Method and apparatus for removing polymer residue from semiconductor wafer edge and back side

摘要

A method for cleaning a semiconductor device has the steps of securing a wafer ( 16 ) with a modified chuck ( 11 ) and applying a cleaning solution ( 18 ) to the backside ( 20 ) of the wafer ( 16 ). The cleaning solution ( 18 ) is formulated to remove PTFE from the wafer ( 16 ). The cleaning solution ( 18 ) is applied to the edge ( 14 ) of the wafer ( 16 ) because of the characteristics of the modified chuck ( 11 ) to remove PTFE impurities that gather on the edge ( 14 ) of the wafer ( 16 ).