发明名称 Light extraction from a semiconductor light emitting device via chip shaping
摘要 A method for designing semiconductor light emitting devices is disclosed wherein the side surfaces (surfaces not parallel to the epitaxial layers) are formed at preferred angles relative to vertical (normal to the plane of the light-emitting active layer) to improve light extraction efficiency and increase total light output efficiency. Device designs are chosen to improve efficiency without resorting to excessive active area-yield loss due to shaping. As such, these designs are suitable for low-cost, high-volume manufacturing of semiconductor light-emitting devices with improved characteristics.
申请公布号 US7268371(B2) 申请公布日期 2007.09.11
申请号 US20050230722 申请日期 2005.09.19
申请人 发明人
分类号 H01L29/22;H01L29/227;H01L33/20 主分类号 H01L29/22
代理机构 代理人
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