发明名称 |
Method of making a microstructure using a circuit board |
摘要 |
A method of making a microstructure includes the steps of providing a circuit board that includes a dielectric layer and a conductor layer formed on the dielectric layer, forming a metal structure on the circuit board such that the metal structure extends through the dielectric layer, and removing at least a portion of the dielectric layer adjacent to the conductor layer and the metal structure to result in the microstructure.
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申请公布号 |
US7267755(B2) |
申请公布日期 |
2007.09.11 |
申请号 |
US20030670190 |
申请日期 |
2003.09.26 |
申请人 |
SENTELIC CORPORATION |
发明人 |
LIN JAO-CHING;DING PEI-PEI |
分类号 |
B81C1/00;C25D1/00;B81B3/00;C23F1/02;C25D1/08;C25D5/02;H05K1/02;H05K3/00;H05K3/40;H05K3/42 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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