发明名称 Method of making a microstructure using a circuit board
摘要 A method of making a microstructure includes the steps of providing a circuit board that includes a dielectric layer and a conductor layer formed on the dielectric layer, forming a metal structure on the circuit board such that the metal structure extends through the dielectric layer, and removing at least a portion of the dielectric layer adjacent to the conductor layer and the metal structure to result in the microstructure.
申请公布号 US7267755(B2) 申请公布日期 2007.09.11
申请号 US20030670190 申请日期 2003.09.26
申请人 SENTELIC CORPORATION 发明人 LIN JAO-CHING;DING PEI-PEI
分类号 B81C1/00;C25D1/00;B81B3/00;C23F1/02;C25D1/08;C25D5/02;H05K1/02;H05K3/00;H05K3/40;H05K3/42 主分类号 B81C1/00
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