<p>The disclosure is directed to a radiation curable composition including abrasive grains and a binder composition. The binder composition includes about 10 wt% to about 90 wt% cationically polymerizable compound, not greater than about 40 wt% radically polymerizable compound, and about 5 wt% to about 80 wt% particulate filler based on the weight of the binder composition. The particulate filler includes dispersed submicron particulates.</p>
申请公布号
MX2007009098(A)
申请公布日期
2007.09.11
申请号
MX20070009098
申请日期
2006.01.27
申请人
SAINT-GOBAIN ABRASIVES, INC.
发明人
YOU, XIAORONG;GAETA, ANTHONY C.;GAETA, ANTHONY C.;RICE, WILLIAM, C.