| 摘要 |
A heat radiator structure using a PCB(Printed Circuit Board) manufacturing method and a thermoelectric element structure using the same are provided to enhance a heat conduction by using the PCB and to increase heat discharge by using heat radiating fins. A heat radiator structure using a PCB manufacturing method includes heat radiating fins(300,350) and PCB substrates(400,460). The heat radiating fins(300,350) have a thin and long rod shape. The PCB substrates(400,460) are coupled to one end of the heat radiating fins(300,350) by soldering with an SMT(Surface Mount Technology) method, and include through holes(405) and copper patterns(410,450). The through holes(405) are formed on the PCB substrates(400,460) and have a metal plating(455) on an inner circumference. The copper patterns(410,450) are formed on surfaces of the PCB substrates(400,460).
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