CHEMICAL - MECHANICAL POLISHING METHOD

摘要

FIELD: semiconductor technological processes, namely production of semiconductor plates with use of mechanical working and chemical etching. ^ SUBSTANCE: method comprises steps of placing semiconductor plate on surface of polishing wheel; supplying liquid polishing composition onto surface of wheel while acting by means of ultrasonic oscillations upon working surfaces of working tips of piezoelectric oscillation systems; providing oscillation amplitude of working tips sufficient for finely spraying of liquid polishing composition; forming large number of drops of aerosol of liquid polishing composition; determining means size and number of drops according to condition of receiving necessary quantity of polishing composition on surface of polishing wheel and providing it by selecting resonance dimension of oscillation system; setting shape and size of working tip of oscillation system and number of outlet openings in it working surface according to condition of forming spraying torch with lengthwise size on surface of polishing wheel no less than diameter half of polishing wheel. ^ EFFECT: possibility for providing uniform and equally planar surface of semiconductor plate due to applying guaranteed quantity of polishing composition onto each spot of polishing wheel surface. ^ 5 dwg