| 摘要 |
A cooling device is provided to improve cooling performance by minimizing flexible resistance when fluid is transported. In a cooling device(100) having a heat dissipation plate(110) comprising a plate(120) and a plurality of plate pins(130), a cooling part(150) transports fluid to the heat dissipation plate. At least one bump is formed on the plate of the heat dissipation plate, and is projected toward the direction of the fluid inputted from the cooling part.
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