发明名称 FUNCTIONAL-ELEMENT-MOUNTED MODULE, PROCESS FOR PRODUCING THE SAME, RESIN SEALING PLATE FOR USE THEREIN, AND SUBSTRATE STRUCTURE FOR RESIN SEALING
摘要 Opposed to substrate (2) having functional element (1) with functional part (1a) mounted thereon, there is disposed resin sealing plate (3) provided with opening (3a) corresponding to the functional part (1a) of the functional element (1) with a given spacing therebetween. Penetration and infill of sealing resin (5) in an interstice between the substrate (2) and the resin sealing plate (3) are carried out by the use of capillary phenomenon. Thus, resin sealing of the functional element (1) can be realizes without damaging to the function of the functional part (1a).
申请公布号 WO2007099677(A1) 申请公布日期 2007.09.07
申请号 WO2006JP323658 申请日期 2006.11.28
申请人 SONY CHEMICAL & INFORMATION DEVICE CORPORATION;HORITA, YOSHIHITO;KANISAWA, SHIYUKI;ASADA, TAKAHIRO;YONEDA, YOSHIHIRO 发明人 HORITA, YOSHIHITO;KANISAWA, SHIYUKI;ASADA, TAKAHIRO;YONEDA, YOSHIHIRO
分类号 H01L21/56;H01L23/02 主分类号 H01L21/56
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