| 摘要 |
A split magnet ring (70), particularly useful in a magnetron plasma reactor (10) for sputter depositing tantalum, tungsten, or other barrier metal into a via and also resputter etching the deposited material from the bottom of the via onto the via side walls. The magnet ring includes two annular magnet rings (72, 74) composed of the same axial polarity separated by a non-magnetic spacing (76) of at least the axial length of one magnet and associated pole faces. A small unbalanced magnetron (36) rotates about the back of the target (16) having an outer pole (42) of the same polarity as the ring magnets (72, 74) surrounding a weaker inner pole (40) of the opposite polarity.
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