| 摘要 |
An integrated-circuit die includes a bypass capacitance (215) shared between two or more circuit blocks (205, 210) . The bypass capacitance (215) is selectively connected to whichever of the circuit blocks is active (e.g., to a transmitting block while a receiving block is off or in a standby mode) . Some embodiments include bypass select logic that can be used to customize the bypass resistance and capacitance on a chip-wide or circuit-specific basis.
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