Nonleaded solder alloy and electronic parts using it,申请号HK20050102215-传众专利搜索

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发明名称	Nonleaded solder alloy and electronic parts using it
摘要
申请公布号	HK1069792(A1)	申请公布日期	2007.09.07
申请号	HK20050102215	申请日期	2005.03.14
申请人	SUMIDA CORPORATION;NIHON GENMA MFG. CO., LTD.	发明人	KOICHI IZUMIDA;YUKI TAKANO;HITOSHI ABE;TOSHIYUKI MORIBAYASHI;KOICHI HAGIO;JUNICHI TAKENAKA
分类号	B23K;B23K35/26	主分类号	B23K
代理机构		代理人
主权项
地址

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