摘要 |
<p>Processing assembly comprising a processing chamber (2) adapted for receiving at least one wafer (5) to be processed, the processing assembly (1) further being provided with a pump (3) being connectable in fluid connection with the processing chamber (2) for maintaining the pressure in the processing chamber (2) in a low pressure range during processing, wherein the processing assembly (1) is provided with a second pump (4) being connectable in fluid connection with the processing chamber (2) for lowering the pressure from a relatively high pressure, e.g. atmospheric pressure, to the low pressure range, wherein gas flow in the processing chamber (2) during lowering the pressure has a constant value. The invention further relates to a method for processing a wafer (5) in such a processing assembly (1).</p> |
申请人 |
NXP B.V.;VAN DE KERKHOF, ANTONIUS, M., C., P., L. |
发明人 |
VAN DE KERKHOF, ANTONIUS, M., C., P., L. |