A no-lead electronic package (70) including a heat spreader (88) and method of manufacturing the same. This method includes the steps of selecting a matrix or mapped no-lead lead frame with die receiving area and leads (74) for interconnect; positioning an integrated circuit device (80) within the central aperture and electrically interconnecting the integrated circuit device (80) to the leads (74); positioning a heat spreader (88) in non-contact proximity to the integrated circuit device (80) such that the integrated circuit device (80) is disposed between the leads (74) and the heat spreader (88); and encapsulating the integrated circuit device (80) and at least a portion of the heat spreader (88) and leads (74) in a molding resin (91).
申请公布号
WO2007100642(A2)
申请公布日期
2007.09.07
申请号
WO2007US04691
申请日期
2007.02.20
申请人
ADVANCED INTERCONNECT TECHNOLOGIES LIMITED;ADVANCED INTERCONNECT TECHNOLOGIES, INC.
发明人
RAMOS, MARY JEAN BAJACAN;SAN ANTONIO, ROMARICO SANTOS;SUBAGIO, ANANG