METHOD OF PROCESSING SUBSTRATE AND CHEMICAL USED IN THE SAME

摘要

A method for processing a substrate is provided to facilitate an ashing process and a removal process if necessary by performing an exposure process twice on an organic layer pattern prior to the removal process so that the organic layer pattern becomes a thin film. At least two exposure processes are performed on a substrate in a substrate processing method including an organic layer pattern process for processing an organic layer pattern. In processing the organic layer pattern, at least a part of the organic layer pattern is shrunk or removed using chemicals. The exposure process can be performed only on the organic layer pattern included in a desired scope of the substrate.