A HALOGEN-FREE PHOSPHOROUS EPOXY RESIN COMPOSITION
摘要
The present invention relates to a polyphosphate-containing halogen-free adhesive, primarily used as an adhesive. The composition comprising the polyphosphate group compounds which effectively meets the needs for environmental protection and flame retardancy, and the high flexibility and flame retardancy of the adhesive made it suitable for using on printed circuit board, especially the flexible printed circuit board.
申请公布号
WO2007100724(A2)
申请公布日期
2007.09.07
申请号
WO2007US04837
申请日期
2007.02.22
申请人
E. I. DU PONT DE NEMOURS AND COMPANY;CHENG, YU, HSAIN;TE, WE, MING;MIN, GARY, YONGGANG