ELECTRONIC PART, ELECTRONIC EQUIPMENT, PROCESS FOR PRODUCING ELECTRONIC PART AND ELECTRONIC OPTICAL PART

摘要

An electronic part is provided to impart a low resistivity, high reliability and excellent thermal safety and processability to an interconnection pattern in a semiconductor device, liquid crystal display panel, etc by adding W to Cu. An electronic part has an interconnection pattern, electrode or contact formed of a metallic material, wherein the metallic material comprises an alloy based on Cu and containing 0.1-7.0 wt% of W and 0.1-3.0 wt% of at least one element selected from the group consisting of Al, Au, Ag, Ti, Ni, Co, and Si. The interconnection pattern, electrode or contact may be formed via an etching step with a solution containing at least one of phosphoric acid and nitric acid.