STRIP FOR INTEGRATED CIRCUIT PACKAGES HAVING A MAXIMIZED USABLE AREA

摘要

A strip (40) on which a plurality of integrated circuit package outlines (42) may be fabricated 'within a plurality of process tools. The strip includes one or more fiducial, notches (44) and/or guide pin notches (46) formed in an outer edge of the strip. The one or more fiducial and/or guide pin notches allow a position of the strip to be identified within at least one process tool of the plurality of process tools. By forming the notches in the outer periphery of the strip, the usable area on the strip on which integrated circuit package outlines may be formed is increased. The strip may alternatively include conventional fiducial and/or guide pin holes (24, 26), with the molding compound applied at least partially around the holes on one or more sides of the strip. The strip may further alternatively include fiducial holes (92) filled with a translucent material that provides stability to the strip while allowing the strip to be used with an optical recognition sensor.