REMOTE CHAMBER METHOD USING SULFUR FLUORIDE FOR REMOVING SURFACE DEPOSITS FROM THE INTERIOR OF A CVD /PECVD- PLASMA CHAMBER

摘要

The present invention relates to an improved remote plasma cleaning method for removing surface deposits from a surface, such as the interior of a process chamber that is used in fabricating electronic devices. The improvement involves addition of a nitrogen source to the feeding gas mixture comprising an oxygen source and sulfur fluoride.