| 摘要 |
PROBLEM TO BE SOLVED: To ensure a good quality of cutting with a high yield even by an operator with a little operational experience or an operator with a low ability by providing a mark for indicating a permissible limit on deviation of a width of cutting on a dicing line itself, when an individual piece of an optical component is obtained by cutting along the dicing line formed on a wafer face of the optical component. SOLUTION: The dicing lines 10 are formed for partitioning and forming a plurality of optical component individual regions 2 with small areas on the face of an optical base plate wafer 1 with a large area, and becomes a guide for a dicing blade 30 during cutting. The dicing lines are successively arranged along the longitudinal direction, and are equipped with wide parts 11 and narrow parts 21 having common central lines. The wide parts indicate the maximum width by which cutting by the dicing blade is permissible, and the narrow parts indicate the permissible range when the central line of the cutting width by the dicing blade is deviated in position in the width direction from the common central line. COPYRIGHT: (C)2007,JPO&INPIT
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