| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a fluid cooling device to which a heat generation body can be easily fixed. <P>SOLUTION: The fluid cooling device 1 is provided with a laminated body 10 in which a flow path is internally formed by laminating laminated plates including heat exchanger plates 111 and flow path plates 112, and fixtures 12 to which a semiconductor package 2 having the heat generation body 23 is fixed, which are respectively provided at each end in a lamination direction of the laminated plates in the laminated body, and which respectively have a thickness dimension larger than that of the heat exchanger plate 111 and flow path plate 112. By this, it is possible to easily fix the semiconductor package 2 to the fixtures 12 by, for example, screwing or the like. It is also possible to prevent exfoliation or the like of the laminated plates, since the semiconductor package 2 is fixed to the fixtures 12 so as not to weaken the bonding strength of the laminated body 10 due to the fixing of the semiconductor package 2. <P>COPYRIGHT: (C)2007,JPO&INPIT |
