发明名称 TEST CONTACT SYSTEM FOR TESTING INTEGRATED CIRCUIT WITH PACKAGE HAVING ARRAY OF SIGNAL AND POWER CONTACT
摘要 <P>PROBLEM TO BE SOLVED: To improve a device that has a load board and an element I/O arranged physically tightly, improves the electric performance, provides compatibility, allows use by both manual and automatic testing devices, and tests a microcircuit. <P>SOLUTION: A contact element comprises a resilient finger projecting section from an insulating contact membrane as a cantilevered beam. The finger has on a contact side thereof, and a conducting contact pad for contacting the microcircuit terminal. The contact element has a plurality of fingers, where each finger is defined in part by two radially oriented slots in the membrane that mechanically separate each finger from every other finger of the plurality of fingers forming the contact element. The contact elements are arranged in a predetermined pattern to form a contact element array. A plurality of connection vias in an interface membrane are arranged in the predetermined pattern of the contact elements, with each of the connection vias is aligned with one of the test contact elements. The connection vias has a cup shape with an open end, with the open end of the cup-shaped via contacting the aligned contact element. The contact and interface membranes are used as part of a test receptacle including a load board on which individual microcircuits are mounted for testing. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007225599(A) 申请公布日期 2007.09.06
申请号 JP20070008136 申请日期 2007.01.17
申请人 JOHNSTECH INTERNATL CORP 发明人 SHERRY JEFFREY C
分类号 G01R1/06;G01R31/26 主分类号 G01R1/06
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