| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a cutting jig capable of preventing a cutting surface and other surfaces from being damaged in cutting an optical substrate wafer so as to raise a nondefective ratio, and to provide an optical substrate wafer cutting method using the cutting jig. <P>SOLUTION: The cutting jig 1 for supporting the optical substrate wafer when the optical substrate wafer 20 is cut into a plurality of optical component pieces by using a cutter 30 comprises: a sufficiently rigid base table 2; and a wafer placement table 10 which is freely removably attached onto the upper surface of the base table, is composed of a material to be cut by the cutter, and has a flat wafer support surface 11. Cutting grooves 12 for allowing the cutter to pass through are formed by the cutter on the wafer support surface of the wafer placement table. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
