| 摘要 |
PROBLEM TO BE SOLVED: To further reduce damage in substrate processing using a two fluid nozzle. SOLUTION: The substrate processing apparatus includes a binary fluid nozzle 2. The binary fluid nozzle 2 has a liquid discharge port 41, and an air discharge port 36 formed like a ring around the liquid discharge port 41. When pure water and nitrogen gas are introduced into the binary fluid nozzle 2, the pure water and the nitrogen gas are mixed after being respectively discharged from the liquid discharge port 41 and the air discharge port 36, and then are supplied as a droplet jet to a wafer W. The air discharge port 36 has an outside diameter (a) of 2 mm to 3.5 mm and a width (c) of 0.05 mm to 0.2 mm. A droplet density on the surface of the wafer W is not smaller than 10<SP>8</SP>/mm<SP>2</SP>per minute. COPYRIGHT: (C)2007,JPO&INPIT
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